The Power Stamp Alliance offers a scalable solution that works alongside existing power conversion devices, enabling the practical execution of applications. It gives power engineers a straightforward yet robust user interface for versatile control over their digitally-managed power stamp products. Additionally, the Alliance guarantees a standardized form factor, mechanical compatibility, feature set, and function to deliver a multi-sourced, standard power supply solution.
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Power Stamp Alliance animated explainer v2
Mar 6, 2020
The Power Stamp Alliance has been formed to define a standard product footprint and functions for board-mounted power conversion from 48 volts-in to low voltage, high current applications.
The founder members are collaborating to create a competitive, multi-vendor ecosystem that drives innovation, lowers costs and reduces supply chain risk.
These 48-volt direct-conversion DC-DC modules – or ‘power stamps’ - primarily target devices being used in large data centers, high performance computing and supercomputing applications such as high-performance CPUs and memory, ASICs or FPGAs.
The power stamps have been defined to include the specific control interfaces required in such applications with the inclusion of both AVS and SVID control functions.
The inherent scalable multiphasic function of adding satellite power stamps to the main power stamp in order to increase the current rating means that the highest current demands can be met with a single, multi-stamp, power conversion stage.
The dimensions of the power stamps have been carefully defined to match the expected application of being located next to a server processor or memory.
The electrical concept of power stamps uses the principle of a discrete, main stamp or controller stamp unit controlling multiple satellite stamp units that combine to achieve more than 1000 amps peak load.
Power stamps are constructed with industry standard components and production processes.
To help you evaluate Power Stamp Alliance member products, we have developed reference designs for various applications, designed to accept any PSA power stamp, with more reference designs to come.
Details on the reference designs are available from any PSA member.
Power Stamp Alliance members are developing a growing range of high density, high current 48 volt-to-point-of-load power stamps.
Whether you are looking for isolated or non-isolated DC-DC conversion, power stamp modules support isolation natively and can be enabled simply by adding a digital isolator.
PCB space can be reduced by 40% or more using a single-stage direct-conversion approach versus the traditional two-stage approach.
For more information on power stamps, including links to products available from Power Stamp Alliance members, please visit www.powerstamp.org
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