OCP Global Summit 2024: Shifts from Open, Standardized Hardware?

• The 2024 OCP Global Summit highlighted shifts in data center standards, presenting both opportunities and challenges, especially for smaller data centers. 
• Key trends discussed at OCP 2024 include:

• AI Power Requirements: Increasing power needs for AI and GPUs, with ORv3 HPR racks evolving to support 200 kW and beyond.
• Cooling Solutions: Shift towards cold plate liquid cooling systems for high-density components, moving away from immersion cooling.
• NVIDIA's Modified ORv3: Introduction of a 19-inch rack standard, potentially influencing wider adoption.

1. AI Power Requirements Drive Evolving Data Center Ecosystem

With the growing demand for AI and the rapidly increasing power requirements for the latest generations of GPUs, the ORv3 HPR rack standard has evolved to 200 kW (and beyond) power. This far exceeds traditional server power requirements at 10 to 20 kW and is even greater than NVIDIA’s latest GB200 NVL72 server rack, which has 120 kW peak power. 

However, the GPU technology roadmap suggests that rack power requirements will continue to go higher and will surpass 200 kW. This may prove challenging for many data centers, as the infrastructure and power requirements necessary to support such higher density are beyond the reach of many smaller facilities.
 
2. Cold Plate Cooling Solutions and Liquid Cooling

The shift toward liquid cooling is noteworthy, with many suppliers moving away from immersion cooling in favor of cold plate cooling systems (liquid-to-liquid or liquid-to-air cooling), pulling heat from CPUs and GPUs and other high-density components within the server. 
  
Cooling is critical to system performance – whether by air or by liquid – and redundancy must be incorporated into the design. The inherent redundant configuration of the ORv3 air-cooled power shelves has proven successful in driving the power for 48 V native chiller motors and fans of these cooling systems.
 
Liquid-cooling isn't currently necessary for power supplies but may be required in the future as power levels increase. Advanced Energy (AE) has extensive experience in liquid cooling system design and implementation and is prepared to support industry needs when higher requirements arise.

3.  Modified version of ORv3 introduced by NVIDIA

This year, NVIDIA introduced a modified version to the ORv3 standard with a 19-inch-wide RU height rack, unlike the standard ORv3 21-inch OU height rack. The NVIDIA rack solution is similar to the OCP ORv3 in that each 48 V power shelf has slots for six power supplies across each rack unit and a management device. It also connects to a single busbar at the back of the rack and incorporates liquid cooling into the chassis.

NVIDIA is a colossus with its leading position in AI data center GPUs, and its support for 19-inch power shelf design could result in wider ecosystem adoption. With this additional architecture available to the market, companies looking to implement the higher efficiency 48 V architecture will need to decide if they will support the OCP standard or invest in NVIDIA’s AI-focused configuration – or, in some instances, both.

It will also be interesting to see if other GPU developers like AMD, which is the world's second-largest GPU supplier, will align with the ORv3 architecture to compete with NVIDIA or adopt the new 19-inch design.

4.   Challenges for Smaller Data Centers

One presentation at OCP noted that assembling a fully OCP-compliant system is still challenging. It is becoming (even more) apparent that many smaller data centers, especially those without a direct relationship with OEM/ODM hardware vendors, are facing difficulties in accessing the latest Open Compute-compatible hardware and software.

While larger providers like Meta and Microsoft can customize equipment to their needs, smaller customers may sometimes struggle with limited options and less influence with hardware vendors. This was underscored by some customers needing to build hybrid systems to integrate both 48 VDC distributed components and more traditional AC to 12 V powered components in a single rack. As demand grows, we believe that more off-the-shelf (OTS) vendors of servers, switches and storage will make ORv3 native (48 VDC input) products available. AE is actively supporting OEM/ODM hardware vendors in the development of ORv3 rack-scale systems to streamline integration.

5.   Advanced Energy’s OCP Related Products

Traditional power form factors were another crucial focus at the 2024 OCP Global Summit, with several companies showcasing concepts for increased power-density for traditional architectures. 

The following are the related Advanced Energy power solutions showcased at the event:
 
CSU Series of M CRPS
AI demands higher power consumption from even traditional form factors. Advanced Energy announced the forthcoming 3.2 kW (12 V output) and 3.6 kW (54 V output) M CRPS PSUs, which drew strong interest.

NDQ Family of DC-DC Converters
AE’s NDQ family 1300, 1600 and 1800 W of non-isolated DC-DC converters is an important capability as the industry moves to 48 VDC input servers, switches and storage devices. With most existing IT devices designed around a 12 V nominal level - a high density and high efficiency DC-DC converter is needed to bring the 48 V down to 12 V without a complete system redesign. AE’s NDQ converters efficiently enable these low voltage circuitry demands. 
Image: Advanced Energy’s NDQ900

ORv3 Power Shelf Architecture
Advanced Energy is one of the few leading suppliers of the latest HPR (High Power) 33 kW ORv3 power shelf built from six 5.5 kW PSUs as well as an 18 kW ORv3 power shelf built from six 3 kW PSUs. In conjunction with our partners, AE also provides the DC-DC charge/discharge built into accompanying ORv3 BBU shelves. 
Image: Advanced Energy’s ORv3 HPR Power Shelf
Summary: 

The 2024 OCP Global Summit highlighted important shifts in data center standards such as M-CRPS, ORv3 and NVIDIA 19-inch power shelves. These innovations present new opportunities but also challenges for smaller data centers struggling to access or adapt to hyperscale-level technology. As NVIDIA’s influence grows, the industry may see more varied "open" architectures, pushing data centers and vendors to choose or integrate multiple standards to support next-generation AI and high-density workloads. 

For more information on Advanced Energy’s presence at OCP, visit: OCP Global Summit 2024 | Advanced Energy and to learn more about AE’s CRPS series of products visit: CRPS Series: Server Power Supply | Advanced Energy.